XD7500NT950
4300FP - Semi-automatic Wafer Bump Testing
MOQ ： piece
Lead Time ： Days
Seller Support : Trade Authenticity Guaranteed & Accepting
Payment : L/C，T/T，Western Union, Money Gram, Credit Card, Paypal
Product details
Supply Ability
- Supply Ability： piecesWarranty(Year)：1 Year
Packaging & Delivery
- Packaging： piece
Product Specifications
Product Description
- Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system
- Fully automatic wafer handling via customer's third party robot handler (SMIF/FOUP) equipment
- Wafer handler and bondtester can operate in isolated environment with minimum operator interaction
- Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer
- Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning
- 460mm x 300mm XY stage with robot compatible chuck. Pneumatically operated pins allow wafer exchange using a robot handler
- 360 degree load tool rotation - optional
- Automatic calibration and linearity checks
- Integrated analysis including statistics and SPC functions
- ODBC compliant
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Business Type : Manufacturer
Company Location: JIANG SU
Year Established: 64YRS
