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4000W Wafer Handling System

MOQ : piece

Lead Time : Days

Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Western Union, Money Gram, Credit Card, Paypal

Product details

Supply Ability

  • Supply Ability: piecesWarranty(Year):1 Year

Packaging & Delivery

  • Packaging: piece

Product Specifications

Product Description

The Nordson DAGE 4000W Wafer Handling System provides significant advantages:

  • Overcomes the need for manual handling of expensive bumped wafers
  • Overcomes the need for operator control of loadtool to bump alignment
  • Increased throughput of bump testing

Key Features

  • Semi-automatic handling of wafers from cassette to bondtester
  • Semi-automatic bump shear testing
  • Semi-automatic transfer of tested wafer back to cassette
  • Wafer orientation and safety interlocks
  • Automatic cassette scan to check location of wafers and the presence of any cross slotted wafers
  • Automated bump shear routines (no camera system needed)
  • 240mm joystick controlled precision XY stage

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